Tensile behavior of free-standing gold films. Part II. Fine-grained films

Acta Materialia

Volumn 51, Issue 7, 2003, Pages 2079-2087

  Emery, R D ^a,b   Povirk, G L ^a,c  

^a Yale University   (United States)

^b INTEL CORPORATION   (United States)

^c Knolls Atomic Power Laboratory   (United States)

Author keywords

Creep; Grain boundary strengthening; Grain size; Tensile testing; Thin films

Indexed keywords

CREEP; GOLD; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; TENSILE TESTING; THIN FILMS;

GRAIN BOUNDARY STRENGTHENING;

METALLIC FILMS;

EID: 0037453247     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(03)00007-7     Document Type: Article

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