Nano-indentation of copper thin films on silicon substrates

Scripta Materialia

Volumn 41, Issue 9, 1999, Pages 951-957

  Suresh, S ^a   Nieh, T G ^b   Choi, B W ^b  

^a USA   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; DISLOCATIONS (CRYSTALS); MECHANICAL PROPERTIES; MICROELECTRONICS; NANOTECHNOLOGY; NUCLEATION; POLYCRYSTALLINE MATERIALS; SHEAR STRENGTH; SHEAR STRESS; SILICON; SUBSTRATES; THIN FILMS;

DISLOCATION NUCLEATION; NANOINDENTATION;

COPPER;

EID: 0033353163     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00245-6     Document Type: Article

References (10)

1. Oliver W.C., Pharr G.M. J. Mater. Res. 7:1992;1564.
2. Suresh S., Giannakopoulos A.E. Acta Mater. 46:1998;5755.
3. Bolshakov A., Oliver W.C., Pharr G.M. J. Mater. Res. 11:1996;760.
4. Corcoran S.G., Colton R.J., Lilleodden E.T., Gerberich W.W. Phys. Rev. B. 55:1997;16057.
5. Wu T.W., Hwang C., Lo J., Alexopoulos P.S. Thin Solid Films. 166:1988;299.
6. Zielinski W., Huang H., Venkatraman S., Gerberich W.W. Phil. Mag. A. 72:1995;1221.
7. A. Gouldstone, A. E. Giannakopoulos, S. Suresh, and K.-Y. Zeng, Acta Mater. (1999), submitted.
8. Larsson P.-L., Giannakopoulos A.E., Soderlund E., Rowcliffe D.J., Vestergaard R. Intl. J. Solids Struct. 33:1996;221.
9. Ma Q., Clarke D.R. J. Mater. Res. 10:1995;853.
10. Venkatraman R., Bravman J.C., Nix W.D., Davies P.W., Flinn P.A., Fraser D.B. J. Electronic Mater. 10:1990;1231.