Effect of frequency on fatigue crack growth along interface between copper film and silicon substrate

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

Volumn 2005, Issue , 2005, Pages 61-66

  Van Truong, Do ^a   Hirakata, Hiroyuki ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COPPER; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); SILICON; SUBSTRATES; THIN FILMS;

COPPER FILMS; FATIGUE CRACK GROWTH; MECHANICAL CRACK GROWTH; STABLE GROWTH REGION;

CRACK PROPAGATION;

EID: 33847270558     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2005.1598236     Document Type: Conference Paper

References (23)

1. th edition, Cambridge: Cambridge University Press, 1998
2. Hertzberg RW, Deformation and Fracture Mechanics of Engineering Materials, New York: John Wiley & Sons Inc, 1995
3. McNaney JM, Cannon RM and Ritchie RO, "Fracture and Fatigue-crack Growth along Aluminum-alumina Interfaces" Acta Materialia, Volume 44, No. 12 (1996), pp. 4713-4728
4. Mutoh Y, Xu JQ, Miyashita Y, Bemardo GG, Takahashi M "Interface Fatigue Crack Propagation in Ceramic Thermal Barrier Coating" JSME International A, Volume 46, No. 3 (2003), pp. 403-408
5. Shaw MC, Marshall DB, Dalgleish BJ, Dadkhah MS, He MY and AG Evans MY "Fatigue crack growth and stress redistribution at interfaces" Acta Metallurgica et Materialia, Volume 42, No. 12 (1994), pp. 4091-4099
6. Reimanis IE,Dalgleish BJ,Brahy M, RühleM and Evans AG "Effects of plasticity on the crack propagation resistance of a metal/ceramic interface" Acta Metallurgica et Materialia, Volume 38, No. 12 (1990), pp. 2645-2652.
7. Mayer H, Papakyriacou M.Pippan R and Stanzl-Tschegg S "Influence of loading frequency on the high cycle fatigue properties of AlZnMgCu1.5 aluminium alloy" Materials Science and Engineering A, Volume 314, No. 1-2 (2001), pp. 48-54
8. Sansoz F and Ghonem H "Effects of loading frequency on fatigue crack growth mechanisms in a/ß Ti microstructure with large colony size" Materials Science and Engineering A, Volume 356, No. 1-2 (2003), pp. 81-92
9. Nakai Y and Hiwa C "Effects of loading frequency and environment on delamination fatigue crack growth of CFRP" International Journal of Fatigue, Volume 24, No. 2-4 (2002), pp. 161-170
10. . J. Morrissey, D. L. McDowell and T. Nicholas "Frequency and stress ratio effects in high cycle fatigue of Ti-6Al-4V" International Journal of Fatigue, Volume 21, No. 7 (1999), pp. 679-685
11. Zhao J, Miyashita Y and Mutoh Y "Fatigue crack growth behavior of 95Pb-5Sn solder under various stress ratios and frequencies" International Journal of Fatigue, Volume 22, No. 8 (2000), pp. 665-673
12. Gingell ADB and King JE "The effect of frequency and microstructure on corrosion fatigue crack propagation in high strength aluminium alloys" Acta Materialia, Volume 45, No. 9 (1997), pp. 3855-3870
13. Yan-Shin Shih and Jien-Jong Chen, "The frequency effect on the fatigue crack growth rate of 304 stainless steel" Nuclear Engineering and Design, Volume 191, No. 2 (1999), pp. 225-230
14. Kamel Makhlouf and Jones JW, "Effects of Temperature and Frequency on Fatigue Crack Growth in 18% Cr Ferritic Stainless Steel" International Journal of Fatigue, Volume 15, No. 3 (1993), pp. 163-171
15. Weidong Xie and Sitaraman SK "Investigation of Interface Delamination of a Cupper-Epoxy Interface Under Monotonic and Cyclic loading: Experimental Characterization" IEEE Transactions on Advanced Packing, Volume 26, No. 4 (2003), pp. 447-452
16. Hirakata H, Kitazawa M, Kitamuara T, "Fatigue crack growth along interface between metal and ceramics submicron-thick films in inert environment" Acta Materialia, in press
17. Toru IKeda, Noriyuki Miyazaki and Toshihiro Soda "Mixed mode fracture criterion of interface crack between dissimilar materials" Engineering Fracture Mechanics, Volume 59, No. 6(1998), pp. 725-735
18. Chen DL, Weiss B and Stickler R "Effect of stress ratio and loading condition on the fatigue threshold" International Journal of Fatigue, Volume 14, No. 5 (1992), pp. 325-329
19. Vinci RP, Zielinski EM and Bravman JC "Thermal strain and stress in copper thin films" Thin Solid Films, Volume 262, No. 1-2 (1995), pp. 142-153
20. Balk TJ, Dehm G and Arzt E "Parallel glide: unexpected dislocation motion parallel to the substrate in ultrathin copper films" Acta Materialia, Volume 51, No. 15 (2003), pp. 4471-4485
21. th edition volume 1, Properties and Selection of Metal, Ohio: American society for Metals, 1975
22. Wiederhorn SM "Influence of Water Vapor on Crack Propagation in Soda-Lime Glass" Journal of the American Ceramic Society, Vol. 50, No. 8(1967), pp. 407-414
23. Magnin T "Recent Advances for Corrosion Fatigue Mechanisms" ISIJ International, Vol. 35 No. 3, pp. 223-233