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Volumn 283, Issue 1-2, 1996, Pages 175-181
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Low cycle fatigue of thin copper foils
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Author keywords
Copper; Electron microscopy; Structural properties; Transmission electron microscopy
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Indexed keywords
COPPER;
DISLOCATIONS (CRYSTALS);
ELECTRODEPOSITION;
FAILURE ANALYSIS;
FATIGUE OF MATERIALS;
GRAIN SIZE AND SHAPE;
GRAPH THEORY;
HARDENING;
NUMERICAL METHODS;
TENSILE PROPERTIES;
TRANSMISSION ELECTRON MICROSCOPY;
TWINNING;
APPLIED STRESS AMPLITUDE;
BASQUIN EQUATION;
CYCLIC HARDENING;
DISLOCATION CELL STRUCTURES;
LAW CYCLE FATIGUE;
STRUCTURAL PROPERTIES;
THIN COPPER FOILS;
METAL FOIL;
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EID: 0030231563
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/0040-6090(95)08225-5 Document Type: Article |
Times cited : (98)
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References (21)
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