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Volumn 283, Issue 1-2, 1996, Pages 175-181

Low cycle fatigue of thin copper foils

Author keywords

Copper; Electron microscopy; Structural properties; Transmission electron microscopy

Indexed keywords

COPPER; DISLOCATIONS (CRYSTALS); ELECTRODEPOSITION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; GRAIN SIZE AND SHAPE; GRAPH THEORY; HARDENING; NUMERICAL METHODS; TENSILE PROPERTIES; TRANSMISSION ELECTRON MICROSCOPY; TWINNING;

EID: 0030231563     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)08225-5     Document Type: Article
Times cited : (98)

References (21)
  • 3
    • 0003816374 scopus 로고
    • J.H. Lau (ed.), Van Nostrand-Reinhold, New York
    • W. Engelmayer, in J.H. Lau (ed.), Solder Joint Reliability, Van Nostrand-Reinhold, New York, 1991.
    • (1991) Solder Joint Reliability
    • Engelmayer, W.1
  • 9
    • 0042410680 scopus 로고    scopus 로고
    • Standard Practice E468, American Society for Testing and Materials, Philadelphia, PA
    • Standard Practice E468, 1983 Annual Book of ASTM Standards, 03.01, American Society for Testing and Materials, Philadelphia, PA, p. 577.
    • 1983 Annual Book of ASTM Standards, 03.01 , pp. 577


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.