Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique

Microelectronic Engineering

Volumn 65, Issue 1-2, 2002, Pages 231-238

  Fang, Te Hua ^a   Chang, Win Jin ^b  

^a SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b KUN SHAN UNIVERSITY   (Taiwan)

Author keywords

Copper; Hardness; Nanoindentation; Young's modulus

Indexed keywords

COMPOSITE MATERIALS; COPPER; ELASTIC MODULI; HARDNESS; LITHIUM COMPOUNDS; NANOTECHNOLOGY;

NANOINDENTATION TECHNIQUE;

THIN FILMS;

EID: 0036892523     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00885-7     Document Type: Article

References (15)

1. Pethica J.B., Hutchings R., Oliver W.C. Phil. Mag. A. 48:1983;593.
2. Bhushan B. Handbook of Micro/Nano Tribology. 1995;CRC Press, Boca Raton, FL.
3. Moody N.R., Gerberich W.W., Burnham N., Baker S.P. Fundamentals of Nanoindentation and Nanotribology. 1998;Materials Research Society, Warrendale, PA.
4. Sun Y., Bell T., Zheng S. Thin Solid Films. 258:1995;198.
5. Wittling M., Bendavid A., Martin P.J., Swain M.V. Thin Solid Films. 270:1995;283.
6. Fougere G.E., Riester L., Ferber M., Weertman J.R., Siegel R.W. Mater. Sci. Eng. A204:1995;1.
7. Woirgard J., Tromas C., Girard J.C., Audurier V. J. Eur. Ceram. Soc. 18:1998;2297.
8. Ohmura T., Matsuoka S., Tananaka K., Yoshida T. Thin Solid Films. 385:2001;198.
9. Chen J.S., Duh J.G. Surf. Coat. Tech. 139:2001;6.
10. Fang T.H., Weng C.I., Chang J.G. Nanotechnology. 11:2000;181.
11. Kulkarni A.V., Bhushan B. Mater. Lett. 29:1996;221.
12. Armstrong R.W., Shin H., Ruff A.W. Acta Metall. Mater. 43:1995;1037.
13. Tsang C.F., Woo J. Mater. Charact. 45:2000;187.
14. Gouldstone A., Koa H.J., Zeng K.Y. Acta Mater. 48:2000;2277.
15. Sanders P.G., Eastman J.A. Acta Mater. 45:1997;4019.