SCOPUS 정보 검색 플랫폼

Materialwissenschaft und Werkstofftechnik

Volumn 39, Issue 2, 2008, Pages 187-192

Tensile and high cycle fatigue test of copper thin film

(5) Park, J H a An, J H b Kim, Y J e Huh, Y H c Lee, H J d

a Tongmyong University (South Korea)

b Korea University (South Korea)

c Korea Research Institute of Standards and Science (South Korea)

d Korea Institute of Machine and Materials (South Korea)

e NONE

Author keywords

Copper; High cycle fatigue test; Mechanical properties; Tensile test; Thin film

Indexed keywords

COPPER; COPPER PLATING; CRACKS; FATIGUE OF MATERIALS; FATIGUE TESTING; MECHANICAL PROPERTIES; SOLIDS; STRENGTH OF MATERIALS; STRESSES; TENSILE TESTING; TESTING; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TIN;

AMBIENT ENVIRONMENTS; COPPER FILMS; COPPER THIN FILMS; ELECTRIC ACTUATORS; ELECTRICAL DEVICES; ELECTRO DEVICES; ETCHING PROCESSES; FATIGUE CHARACTERISTICS; FATIGUE LIVES; FATIGUE STRENGTHS; GOODMAN METHODS; HIGH CYCLE FATIGUE TEST; HIGH CYCLE FATIGUE TESTS; LOADCONTROLLED; MEAN STRESSES; MEASURED VALUES; TAPE CARRIER PACKAGES; TENSILE TEST; TEST MACHINES; ULTIMATE STRENGTHS; ULTIMATE TENSILE STRENGTHS; YOUNG'S MODULUS;

STATISTICAL TESTS;

EID: 42549137935 PISSN: 09335137 EISSN: 15214052 Source Type: Journal
DOI: 10.1002/mawe.200700262 Document Type: Article

Times cited : (34)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.