Plane-strain bulge test for nanocrystalline copper thin films

Scripta Materialia

Volumn 57, Issue 6, 2007, Pages 541-544

  Wei, Xiaoding ^a,b   Lee, Dongyun ^c   Shim, Sanghoon ^d   Chen, Xi ^a,b   Kysar, Jeffrey W ^a,b  

^a Och Spine at New York Presbyterian Hospitals   (United States)

^b Materials Science and Technology Division ^*  (United States)

^c Korea Institute of Science and Technology   (South Korea)

^d OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Bulge test; Nanocrystalline materials; Thin films

Indexed keywords

NANOCRYSTALLINE FILMS; PLANE STRAIN BULGE TESTS;

COPPER; ELASTIC MODULI; NANOCRYSTALLINE MATERIALS; PLASTIC DEFORMATION; STRAIN MEASUREMENT; STRAIN RATE; THERMAL EVAPORATION; YIELD STRESS;

THIN FILMS;

EID: 34447251637     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.05.012     Document Type: Article

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