The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Soldering and Surface Mount Technology

Volumn 18, Issue 4, 2006, Pages 48-56

  Pan, Jianbiao ^a   Toleno, Brian J ^b   Chou, Tzu Chien ^a   Dee, Wesley J ^a  

^a CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

^b Henkel Technologies   (United States)

Author keywords

Fracture; Shear strength; Soldering

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; FRACTURE; METALLIZING; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; SURFACES;

FRACTURE INTERFACES;

SOLDERED JOINTS;

EID: 33751161452     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610717901     Document Type: Article

References (13)

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