Formation and characterization of cobalt-reinforced Sn-3.5Ag solder

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 244-249

  Lee, Jung Sub ^a   Chu, Kun Mo ^a   Jeon, Duk Young ^a   Patzelt, Rainer ^b   Manessis, Dionysios ^b   Ostmann, Andreas ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; EUTECTICS; INTERMETALLICS; MELTING; REINFORCEMENT; SHEAR STRENGTH;

MELTING TEMPERATURE; SOLDER MATRIX; SOLDER PASTE;

SOLDERING ALLOYS;

EID: 33845586481     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645654     Document Type: Conference Paper

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