Three-dimensional simulation of intermetallic compound layer growth in a binary alloy system

Acta Materialia

Volumn 57, Issue 4, 2009, Pages 1254-1262

  Kim, Hee Soo ^a   Lee, Hyun Jung ^a   Yu, Yeon Seop ^a   Won, Yong Sun ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

Grain boundary diffusion; Grain growth; Intermetallic compound; Phase field model

Indexed keywords

ALLOYING; BINARY ALLOYS; CRYSTAL GROWTH; DIFFUSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH (MATERIALS); GROWTH KINETICS; INTERMETALLICS; MICROSTRUCTURAL EVOLUTION; OSTWALD RIPENING; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; THREE DIMENSIONAL; THREE DIMENSIONAL COMPUTER GRAPHICS;

ALLOY SYSTEMS; DIFFUSIVITIES; GRAIN BOUNDARY DIFFUSION; GRAIN-BOUNDARY; IMC LAYERS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND LAYER GROWTHS; LITERATURE MODELS; MICRO-STRUCTURAL; NORMAL GRAIN GROWTHS; PHASE-FIELD MODEL; PHASE-FIELD SIMULATIONS; SIMULATION RESULTS; THREE-DIMENSIONAL SIMULATIONS;

GRAIN GROWTH;

EID: 59349085507     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.11.006     Document Type: Article

References (44)

1. Tu K.N., Gusak A.M., and Li M. J Appl Phys 93 (2003) 1335
2. Laurila T., Vuorinen V., and Kivilahti J.K. Mater Sci Eng R 49 (2005) 1
3. Liu C.Y., Chen C., Mal K., and Tu K.N. J Appl Phys 85 (1999) 3882
4. Vianco P.T., Erickson K.L., and Hopkins P.L. J Electron Mater 23 (1994) 721
5. Lee H.T., and Chen M.H. Mater Sci Eng A 333 (2002) 24
6. Kajihara M. Mater Sci Eng A 403 (2005) 234
7. Zhu Q.S., Zhang Z.F., Shang J.K., and Wang Z.G. Mater Sci Eng A 435-436 (2006) 588
8. Kang S.K., and Ramachandran V. Scripta Metall 14 (1980) 421
9. Kim H.K., Liou H.K., and Tu K.N. Appl Phys Lett 66 (1995) 2337
10. Gur D., and Bamberger M. Acta Mater 46 (1998) 4917
11. Lee J.H., Park J.H., Lee Y.H., Kim Y.S., and Shin D.H. J Mater Res 16 (2001) 1227
12. Tu P.L., Chan Y.C., Hung K.C., and Lai J.K.L. Scripta Mater 44 (2001) 317
13. Gagliano R.A., and Fine M.E. J Electron Mater 32 (2003) 1441
14. Ma X., Wang F., Qian Y., and Yoshida F. Mater Lett 57 (2003) 3361
15. Vianco P.T., Rejent J.A., and Hlava P.F. J Electron Mater 33 (2004) 991
16. Huang M.L., Loeher T., Ostmann A., and Reichl H. Appl Phys Lett 86 (2005) 181908
17. Onishi M., and Fujibuchi H. Trans JIM 16 (1975) 539
18. Haimovich J. AMP J Tech 3 (1993) 46
19. Erickson K.L., Hopkins P.L., and Vianco P.T. J Electron Mater 23 (1994) 729
20. Gorlich J., Schmitz G., and Tu K.N. Appl Phys Lett 86 (2005) 053106
21. Liao C.N., and Wei C.T. Thin Solid Films 515 (2006) 2781
22. Kidson G.V. J Nucl Mater 3 (1961) 21
23. Gibbs G.B. J Nucl Mater 20 (1966) 303
24. Wagner C. Acta Metall 17 (1969) 99
25. Onishi M., and Wakamatsu Y. J Jpn Inst Met 37 (1973) 1279
26. Mei Z., Sunwoo A.J., and Morris Jr. J.W. Metall Trans A 23 (1992) 857
27. Schaefer M., Laub W., Sabee J.M., and Fournelle R.A. J Electron Mater 25 (1996) 992
28. Tanaka Y., and Kajihara M. Mater Sci Eng A 459 (2007) 101
29. Umantsev A. J App Phys 101 (2007) 024910
30. Huh J.Y., Hong K.K., Kim Y.B., and Kim K.T. J Electron Mater 33 (2004) 1161
31. Hong K.K., and Huh J.Y. J Electron Mater 35 (2006) 56
32. Schaefer M., Fournelle R.A., and Liang J. J Electron Mater 27 (1998) 1167
33. Ghosh G. J Appl Phys 88 (2000) 6887
34. Kim S.G. Acta Mater 55 (2007) 6513
35. Kim S.G., Kim W.T., Suzuki T., and Ode M. J Cryst Growth 261 (2004) 135
36. Kim S.G., Kim D.I., Kim W.T., and Park Y.B. Phys Rev E 74 (2006) 061605
37. Anderson M.P., Srolovitz D.J., Grest G.S., and Sahni P.S. Acta Metall 32 (1984) 783
38. Blikstein P., and Tschiptschin A.P. Mater Res 2 (1999) 133
39. Hillert M. Acta Metall 13 (1965) 227
40. Lifshitz I.M., and Slyozov V.V. Phys Chem Sol 19 (1961) 35
41. Wagner C. Z Electrochem 65 (1961) 581
42. Kim H.K., and Tu K.N. Phys Rev B 53 (1996) 16027
43. Kim HS, unpublished work.
44. Gusak A.M., and Tu K.N. Phys Rev B 66 (2002) 115403