Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 486-493

  Kao, Szu Tsung ^a   Lin, Yung Chi ^b   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NONE

Author keywords

Composite solder; Cu6Sn5; Electroless Ni P; Elemental distribution; Mechanical alloying; SnAgCu

Indexed keywords

COMPOSITE SOLDER; CU6S5; ELECTROLESS NI-P; ELEMENTAL DISTRIBUTION; SNAGCU;

CONTACT ANGLE; HEAT TREATMENT; INTERMETALLICS; MECHANICAL ALLOYING; NANOSTRUCTURED MATERIALS; SURFACE CHEMISTRY; WETTING;

SOLDERED JOINTS;

EID: 33645571600     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690536     Document Type: Article

References (20)

1. S. Choi, T.R. Bieler, J.P. Lucas, and K.N. Subramanian, J. Electron. Mater. 28, 1209 (1999).
2. A.J. Sunwoo, J.W. Morris, Jr., and G.K. Lucey, Jr., Metall. Trans. A 23, 1323 (1992).
3. J.H. Lee, D. Park, J.T. Moon, Y.H. Lee, D.H. Shin, and Y.S. Kim, J. Electron. Mater. 29, 1264 (2000).
4. D. Lin, G.X. Wang, T.S. Srivatsan, M.A. Hajri, and M. Petraroli, Mater. Lett. 53, 333 (2002).
5. Y. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs, and R.F. Pinizzotto, J. Electron. Mater. 22, 769 (1993).
6. S.Y. Huang, J.W. Lee, and Z.H. Lee, J. Electron. Mater. 31, 1304 (2002).
7. R.C. Reno, M.J. Panunto, and B.H. Piekarski, J. Electron. Mater. 26, 11 (1997).
8. H.S. Betrabet, S.M. McGee, and J.K. McKinlay, Scr. Metall. 25, 2323 (1991).
9. J.H. Lau, C.P. Wong, N.C. Lee, and S.W.R. Lee, Electronics Manufacturing: With Lead-Free, Halogen-Free and Conductive-Adhesive Materials (New York: McGraw-Hill, 2003).
10. M.L. Huang, C.M.L. Wu, J.K.L. Lai, and Y.C. Chan, J. Electron. Mater. 29, 1021 (2000).
11. M.L. Huang, C.M.L. Wu and J.K.L. Lai, J. Mater. Sci.: Mater. Electron. 11, 57 (2000).
12. J.S. Benjamin, Sci. Am. 234, 40 (1976).
13. H.L. Lai and J.G. Duh, J. Electron. Mater. 32 (4), 215 (2003).
14. S.T. Kao and J.G. Duh, J. Electron. Mater. 33 (12), 1445 (2004).
15. J.I. Goldstein, Scanning Electron Microscopy and X-ray Microanalysis (New York: Plenum Press, 1981).
16. K.S. Kim, S.H. Huh, and K. Suganuma, J. Alloys Compd. 352, 226 (2003).
17. M. McCormack, G.W. Kammlott, H.S. Chen, and S. Jin, Appl. Phys. Lett. 65, 1233 (1994).
18. L. Ye, Z.H. Lai, J. Liu, and A. Thölén, Soldering Surf. Mount Technol. 13, 16 (2001).
19. S.J. Wang and C.Y. Liu, J. Electron. Mater. 32, 1303 (2003).
20. URL: http://www.yikst.com/Page/YIKSTE.html.