Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys

Journal of Alloys and Compounds

Volumn 352, Issue 1-2, 2003, Pages 237-245

  Kim, Young Sun ^a   Kim, Keun Soo ^a   Hwang, Chi Won ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Bi segregation; Cooling rate; Eutectic alloy; Lead free; Sn Zn; Solder

Indexed keywords

ADDITION REACTIONS; COOLING; EUTECTICS; MELTING; MICROSTRUCTURE; TENSILE PROPERTIES;

DENDRITE STRUCTURES;

TIN ALLOYS;

EID: 0037464016     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(02)01168-4     Document Type: Article

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