Characterization of Co-Sn intermetallic compounds in Sn-3.0Ag-0.5Cu-0.5Co lead-free solder alloy

Materials Letters

Volumn 62, Issue 15, 2008, Pages 2257-2259

  Gao, Feng ^a,c   Cheng, Fangjie ^a,b,c   Nishikawa, Hiroshi ^a,c   Takemoto, Tadashi ^a,c  

^a OSAKA UNIVERSITY   (Japan)

^b TIANJIN UNIVERSITY   (China)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Addition; Co Sn intermetallic; Lead free solder; Nanoindentation; Phase transformation

Indexed keywords

COBALT COMPOUNDS; COOLING; NANOINDENTATION; REACTION KINETICS; SOLIDIFICATION; TIN ALLOYS;

COOLING RATES; INTERMETALLIC PHASES;

INTERMETALLICS;

EID: 41549139282     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2007.11.060     Document Type: Article

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