Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1445-1451

  Kao, Szu Tsung ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Composite solder; Fracturing; Lead free solder paste; Mechanical alloying (MA); Welding

Indexed keywords

COMPOSITE MATERIALS; EUTECTICS; FRACTURE; PARTICLE SIZE ANALYSIS; SILICON; SOLDERING ALLOYS; THERMAL EFFECTS; TIN ALLOYS; WELDING;

COMPOSITE SOLDERS; LEAD-FREE SOLDER PASTES; MECHANICAL ALLOYING (MA);

COPPER;

EID: 11344289777     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0085-y     Document Type: Conference Paper

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