Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Kim, Soo Yeol ^a   Oh, Tae Sung ^b   Lee, Won Jong ^c   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

^b Hong Ik University   (South Korea)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE FILMS; FLIP CHIP DEVICES; LOW TEMPERATURE EFFECTS; WAFER BONDING;

ANISOTROPY CONDUCTIVE FILMS; NON-CONDUCTIVE ADHESIVES;

SOLDERED JOINTS;

EID: 34948855305     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359782     Document Type: Conference Paper

References (8)

1. http://www.flipchips.com/tutorial01.html.
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3. th Electronic Components and Technology Conf, San Diego, May. 2002, pp. 1385-1389.
4. R. Nagle, F. Stam, J. Barret, "Evaluation of adhesive based flip-chip interconnect techniques", Int. J. Microelectron. Packag. Mater. Technol., Vol. 1, No. 3, (1998), pp. 187-196.
5. Clyde F. Jr. Coombs, Printed Circuits Handbook, McGraw-Hill (New York, 2001), pp. 26-28.
6. B.Y. Kim, Z.G. Chen, Y-H Kim, " The COG Bonding using Sn Bump and Non-conductive Adhesive", MICRO SYSTEM technologies, (2005), pp. 582-585.
7. Z.G. Chen, Y-H Kim, "A new COP bonding using non-conductive adhesives for LCDs driver IC packaging", Displays, Vol 27, No 3, (2006), pp. 130-135.
8. S.M. Lee, B.Y. Kim, Y-H Kim, "The Chip-on Glass Bonding using Non-Conductive Adhesive and Sn bump: Effect of Sn bump Types on the NCA Trapping", Proc Int. Conf. on Electronics Packaging, Tokyo, April. 2006, pp. 48-52.