Mechanics of adhesively bonded flip-chip-on-flex assemblies. Part II: Effect of bump coplanarity on manufacturability and durability of non-conducting adhesive assemblies

Journal of Adhesion Science and Technology

Volumn 22, Issue 14, 2008, Pages 1757-1780

  Farley, D ^a   Dasgupta, A ^a   Caers, J F J ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Contact force; Contact surface area; Copper bump; Curing shrinkage; Elastic plastic deformation; Fabrication pressure; FCOF; Gold bump; Non conductive adhesive; Residual pre stress; Viscoplasticity

Indexed keywords

CONTACT FORCE; CONTACT SURFACE AREA; COPPER BUMP; CURING SHRINKAGE; ELASTIC-PLASTIC DEFORMATION; FCOF; GOLD BUMP; NON-CONDUCTIVE ADHESIVE; RESIDUAL PRE-STRESS;

ADHESIVE JOINTS; ADHESIVES; CURING; DURABILITY; ELASTIC DEFORMATION; ELASTOPLASTICITY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; GOLD; MECHANICS; PLASTIC DEFORMATION; PLASTICITY; PLASTICS; SHRINKAGE; VISCOPLASTICITY; VISCOSITY;

CONDUCTING POLYMERS;

EID: 68949122820     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X320573     Document Type: Article

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