Investigation of dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 73-83

  Yen, Yee Wen ^a   Chou, Weng Ting ^a   Tseng, Yu ^a   Lee, Chiapyng ^a   Hsu, Chun Lei ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Dissolution behavior; Dissolution mechanism; Grain boundary; Intermetallic compound (IMC); Lattice diffusion

Indexed keywords

DISSOLUTION BEHAVIOR; DISSOLUTION MECHANISM; INTERMETALLIC COMPOUND (IMC); LATTICE DIFFUSION; MOLTEN SOLDERS;

DIFFUSION; DISSOLUTION; GRAIN BOUNDARIES; MOLTEN MATERIALS; SOLDERING ALLOYS;

INTERMETALLICS;

EID: 37249046517     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0266-6     Document Type: Article

References (27)

1. D.R. Frear, P.T. Vianco, Metallurg. Trans. A, 25A, 1509 (1994)
2. B. Trumble and J. Brydges, Electronics and the Environment, 1998. ISEE-1998. Proceedings of the 1998 IEEE International Symposium on (Oak Brook, IL: Institute of Electrical & Electronics Engineers, Inc., 1998)
3. A.Z. Miric, A. Girusd, Solder. Surf. Mount Technol., 10, 19 (1998)
4. Waste Electrical and Electronic Equipment, http://ec.europa. eu/environment/waste/weee/index_en.htm (2007)
5. J. Glazer, Int. Mater. Rev., 40, 65 (1995)
6. Y.M. Liu, T.H. Chuang, J. Electr. Mater., 29, 1047 (2000)
7. L.H. Su, Y.W. Yen, C.C. Lin, S.W. Chen, Metallurg. Mater. Trans. B, 28B, 927 (1997)
8. M.O. Alam, Y.C. Chan, K.N. Tu, J. Appl. Phys., 94, 7904 (2003)
9. S. Mannan, M.P. Clode, Soldering Surf. Mount Technol., 16, 31 (2004)
10. A. Sharif, Y.C. Chan, Mater. Sci. Eng. B, 106, 126 (2004)
11. C.H. Yu, K.L. Lin, J. Mater. Res., 20, 666 (2005)
12. A. Sharif, Y.C. Chan, J. Alloy. Comp., 390, 67 (2005)
13. D.Q. Yu, C.M.L. Wu, C.M.T. Law, L. Wang, J.K.L. Lai, J. Alloy. Comp., 392, 192 (2005)
14. P.Y. Yeh, J.M. Song, K.L. Lin, J. Electr. Mater., 35, 978 (2006)
15. I. Karakaya, W.T. Thompson, Binary Alloy Phase Diag., 1, 94 (1991)
16. H.K. Kim, K.N. Tu, Phys. Rev. B, 53, 16027 (1996)
17. K. Suganuma, K. Niihara, T. Shoutoku, Y. Nakamura, J. Mater. Res., 13, 2859 (1998)
18. K.N. Tu, Mater. Chem. Phys., 46, 217 (1996)
19. M. Schaefer, R.A. Fournelle, J. Liang, J. Electr. Mater., 27, 1167 (1998)
20. H. Okamoto, Binary Phase Diagram (ASM International, Materials Park, OH, 1990)
21. C.Y. Chou, S.W. Chen, Y.S. Chang, J. Mater. Res., 21(7), 1849 (2006)
22. Y.W. Yen, C.C. Jao, Chiapyng Lee, J. Mater. Res., 21, 2986 (2006)
23. V.I. Dybkov, Growth Kinetics of Chemical Compound Layers (Cambridge, UK: Cambridge International Science Publishing, 1998)
24. N. Saunders, A.P. Miodownik, Binary of Alloy Phase Diag., 11, 278 (1990)
25. D.J. Chakrabarti, D.E. Laughlin, Binary of Alloy Phase Diag., 11, 732 (1990)
26. C.N Chiu and S.W. Che, private communication
27. Y.W. Yen, C.C. Jao, and Chiapyng Lee, submit to Intermetallics (2007)