Statistical characterization of open failures in the fine-pitch COG interconnection

Journal of Electronic Materials

Volumn 37, Issue 12, 2008, Pages 1851-1857

  Choi, S ^a   Hwang, S Y ^a   Oh, W S ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

ACF; Bump; COG; Electrode; Fine pitch; NCF

Indexed keywords

ACF; BUMP; COG; FINE PITCH; NCF;

CONDUCTIVE FILMS; ELECTROLYSIS; GRAIN SIZE AND SHAPE; PARTICLE SIZE; PROBABILITY; RANDOM PROCESSES; STATISTICAL METHODS;

PROBABILITY DISTRIBUTIONS;

EID: 54949121289     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0531-3     Document Type: Article

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