Contact resistance of the chip-on-glass bonded 48Sn-52In solder joint

Materials Transactions

Volumn 46, Issue 5, 2005, Pages 1042-1046

  Choi, Jae Hoon ^a   Lee, Kwang Yong ^a   Jun, Sung Woo ^a   Kim, Young Ho ^b   Oh, Tae Sung ^a  

^a Hong Ik University   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

48tin 52indium solder; Chip on glass; Contact resistance; Flip chip; Solder joint

Indexed keywords

48TIN-52INDIUM SOLDERS; CHIP ON GLASS; CONTACT RESISTANCE; DAISY CHAIN STRUCTURE; FLIP CHIPS; SHEET RESISTANCE; WET ETCHING;

ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ETCHING; LIQUID CRYSTAL DISPLAYS; MOBILE TELECOMMUNICATION SYSTEMS; SCANNING ELECTRON MICROSCOPY; SHEET METAL; SOLDERING ALLOYS; THIN FILMS; TIN ALLOYS;

SOLDERED JOINTS;

EID: 22444433476     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.1042     Document Type: Article

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