Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2335-2340

  Kim, Jong Woong ^a   Moon, Won Chul ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Anisotropic conductive film; Bonding pressure; Flip chip; Reliability

Indexed keywords

BONDING; DELAMINATION; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

ADHESIVE MATRIX THICKNESS; ANISOTROPIC CONDUCTIVE FILM; BONDING PRESSURE; FAILURE BEHAVIORS;

THIN FILMS;

EID: 33751228449     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.029     Document Type: Article

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