Assembly process modeling for flip chip on flex interconnections with non-conductive adhesive

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 803-808

  Zhang, Xiaowu ^a   Wong, E H ^a   Rajoo, R ^a   Iyer, M K ^a   Caers, J F J M ^b   Zhao, X J ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CHARACTERIZATION; CHIP SCALE PACKAGES; CONTACT RESISTANCE; CURING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PROCESS ENGINEERING;

ASSEMBLY PROCESS MODELING; AXISYMMETRIC FINITE ELEMENTS; DIGITAL MULTIMETERS; EXPERIMENTAL TECHNIQUES; FINITE ELEMENT SIMULATIONS; MATERIAL CHARACTERIZATIONS; NON-CONDUCTIVE ADHESIVES; RELIABILITY PERFORMANCE;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84954049955     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271628     Document Type: Conference Paper

References (10)

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