Chip on glass - Interconnect for row/column driver packaging

Microelectronics Journal

Volumn 29, Issue 6, 1998, Pages 343-349

  Joshi, Rajeev ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; FLAT PANEL DISPLAYS; FLIP CHIP DEVICES; LIQUID CRYSTAL DISPLAYS; MICROPROCESSOR CHIPS; SEMICONDUCTING GLASS; TECHNOLOGY;

CHIP ON GLASS INTERCONNECT; FLIP CHIP ON GLASS;

ELECTRONICS PACKAGING;

EID: 0032093992     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(97)00071-2     Document Type: Article

References (12)

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