Temperature- and moisture-induced warpages of COG package with non-conductive paste adhesive

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1928-1934

  Tsai, M Y ^a   Huang, C Y ^a   Chiang, C Y ^a   Chen, W C ^b   Yang, S S ^b  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTERFACES (MATERIALS); LAMINATING; LIQUID CRYSTAL DISPLAYS; MOISTURE; THIN FILMS;

ANISOTROPIC CONDUCTIVE FILM (ACF); NON-CONDUCTIVE PASTE (NCP); TWYMAN-GREEN INTERFEROMETRY; WARPAGE;

ADHESIVES;

EID: 33845563684     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645925     Document Type: Conference Paper

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