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Volumn , Issue , 2007, Pages 423-426

Integrated MEMS LC resonator with sealed air-suspended structure for single-chip RF LSIs

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRON DEVICES; ELECTRONIC EQUIPMENT MANUFACTURE; LSI CIRCUITS; MEMS; METALS; OSCILLATORS (ELECTRONIC); RESONATORS; VARACTORS;

EID: 50249134337     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2007.4418963     Document Type: Conference Paper
Times cited : (8)

References (8)
  • 1
    • 0032137442 scopus 로고    scopus 로고
    • Micromachined devices for wireless communications
    • Aug
    • C. T.-C. Nguyen, L. P. B. Katehi, and G. M. Rebeiz, "Micromachined devices for wireless communications," Proc. IEEE, vol. 86, no. 8, pp. 1756-1768, Aug. 1998.
    • (1998) Proc. IEEE , vol.86 , Issue.8 , pp. 1756-1768
    • Nguyen, C.T.-C.1    Katehi, L.P.B.2    Rebeiz, G.M.3
  • 4
    • 0038546678 scopus 로고    scopus 로고
    • On the design of RF spiral inductors on silicon
    • Mar
    • J. N. Burghartz and Behzad Rejaei, "On the design of RF spiral inductors on silicon, " IEEE Trans. Electron Devices, vol. 50, no. 3, pp. 718-729, Mar. 2003.
    • (2003) IEEE Trans. Electron Devices , vol.50 , Issue.3 , pp. 718-729
    • Burghartz, J.N.1    Rejaei, B.2
  • 7
    • 0001563141 scopus 로고    scopus 로고
    • Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing
    • K. Machida, H. Kyuragi, H. Akiya, K. Imai, A. Tounai, and A. Nakashima, "Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing," J Vac. Sci. Technol., vol. B 16, pp. 1093-1097, 1998.
    • (1998) J Vac. Sci. Technol , vol.B 16 , pp. 1093-1097
    • Machida, K.1    Kyuragi, H.2    Akiya, H.3    Imai, K.4    Tounai, A.5    Nakashima, A.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.