New three-dimensional integration technology using self-assembly technique

Technical Digest - International Electron Devices Meeting, IEDM

Volumn 2005, Issue , 2005, Pages 348-351

  Fukushima, Takafumi ^a   Yamada, Yusuke ^a   Kikuchi, Hirokazu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATION; RANDOM ACCESS STORAGE; SELF ASSEMBLY; THREE DIMENSIONAL COMPUTER GRAPHICS;

SELF-ASSEMBLY TECHNIQUES; SUPER-SMART-STACK TECHNOLOGY;

MICROPROCESSOR CHIPS;

EID: 33847732625     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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