Novel interconnection technology for heterogeneous integration of MEMS-LSI multi-chip module

Microsystem Technologies

Volumn 16, Issue 3, 2010, Pages 441-447

  Lee, Kang Wook ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP DESIGN; FUNDAMENTAL CHARACTERISTICS; HETEROGENEOUS INTEGRATION; INTERCONNECTION TECHNOLOGY; LSI CHIPS; MEMS CHIPS; PRESSURE SENSING; SENSING ELEMENTS; SI SUBSTRATES; STEP HEIGHT; STRONG SOLUTION;

LSI CIRCUITS; MEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 73449098888     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0941-z     Document Type: Article

References (9)

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