Investigation of key technologies for system-in-package integration of inertial MEMS

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2009, Pages 35-40

  Marenco, N ^a   Reinert, W ^a   Warnat, S ^a   Lange, P ^a   Gruenzig, S ^a   Allegato, G ^b   HillmannG , ^c   Kostner, H ^c   Gal, W ^d   Guadagnuolo, S ^e   Conte, A ^e   Malecki, K ^f   Friedel, K ^f  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^b STMICROELECTRONICS   (Italy)

^c Datacon Technology GmbH   (Australia)

^d FICO BV   (Netherlands)

^e SAES GETTERS S P A   (Italy)

^f WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

HYBRID INTEGRATION; INERTIAL SENSOR; KEY TECHNOLOGIES; MEMS PACKAGING; RESONANT DEVICE; SYSTEM IN PACKAGE; THIN WAFERS; VACUUM PACKAGING; WAFER TO WAFER BONDING; WAFER TRANSFERS;

CELLULAR RADIO SYSTEMS; MEMS; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SYSTEMS ANALYSIS; THICK FILM DEVICES; VACUUM DEPOSITION; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 70349205855     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. P. Merz, W. Reinert, K. Reimer, B. Wagner: "PSM-X2: Polysilicon surface micromachining process platform for vacuum-packaged sensors". Konferenzband Mikrosystemtechnik-Kongress 2005, D/Freiburg, VDE Verlag, pp. 467-470
2. P. Lange et al.: "Dicing of Fragile MEMS Structures", Proceedings of MRS Fall Meeting 2008, Boston (MA), USA