Effects of vacuum ultraviolet photons, ion energy and substrate temperature on line width roughness and RMS surface roughness of patterned 193nm photoresist

Journal of Physics D: Applied Physics

Volumn 44, Issue 8, 2011, Pages

  Titus, M J ^a   Graves, D B ^a   Yamaguchi, Y ^b   Hudson, E A ^b  

^a University of California   (United States)

^b LAM RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

193 NM PHOTORESISTS; AFM; CONTROL SAMPLES; EXPOSURE-TIME; FLUENCES; HIGH ENERGY; ICP SYSTEMS; ION ENERGIES; ION FLUXES; LINEWIDTH ROUGHNESS; LOW FREQUENCY; PHOTON FLUX; SAMPLE TEMPERATURE; SUBSTRATE TEMPERATURE; VACUUM ULTRAVIOLETS;

ARGON; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; CHEMICAL MODIFICATION; ELECTROMAGNETIC INDUCTION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FOURIER TRANSFORMS; INDUCTIVELY COUPLED PLASMA; ION BOMBARDMENT; IONS; METAL ANALYSIS; PHOTONS; PHOTORESISTS; ROUGHNESS MEASUREMENT; SCANNING ELECTRON MICROSCOPY; SURFACE MORPHOLOGY; SURFACE PROPERTIES; VACUUM;

SURFACE ROUGHNESS;

EID: 79951776223     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/44/8/085204     Document Type: Article

References (37)

1. Bazin A, Pargon E, Mellahoui X, Perret D, Mortini B and Joubert O 2008 Impact of HBr and Ar Cure Plasma Treatments on 193 nm Photoresists (San Jose, CA, 25 February 2008) Proc. SPIE 6923 692337
2. Engelmann S, Bruce R L, Sumiya M, Kwon T, Phaneuf R, Oehrlein G S, Andes C, Graves D, Nest D and Hudson E A 2009 J. Vac. Sci. Technol. B 27 92-106
3. Englemann S, Bruce R L, Kwon T, Phaneuf R, Oehrlein G S, Bae Y C, Andes C, Graves D, Nest D, Hudson E A, Lazzeri P, Iacob E and Anderle M 2007 J. Vac. Sci. Technol. A 25 12
4. Jinnai B, Koyama K, Kato K, Yasuda A, Momose H and Samukawa S 2009 J. Appl. Phys. 105 053309
5. Negishi N, Takesue H, Sumiya M, Yoshida T, Momonoi Y and Izawa M 2005 J. Vac. Sci. Technol. B 23 217
6. Nest D, Chung T Y, Graves D B, Engelmann S, Bruce R L, Weilnboeck F, Oehrlein G, Wang D, Andes C and Hudson E 2009 Plasma Process. Polym. 6 649
7. ITRS, 2006 edn (ITRS, 2006)
8. Hua X, Engelmann S, Oehrlein G S, Jiang P, Lazzeri P, Iacob E and Anderle M 2006 J. Vac. Sci. Technol. B 24 1850
9. Kim J, Chae Y S, Lee W S, Shon J W, Kang C J, Han W S and Moon J T 2003 J. Vac. Sci. Technol. B 21 790
10. Ling L, Hua X, Li X, Oehrlein G S, Hudson E A, Lazzeri P and Anderle M 2004 J. Vac. Sci. Technol. B 22 2594
11. Sumiya M, Bruce R, Engelmann S, Weilnboeck F and Oehrlein G S 2008 J. Vac. Sci. Technol. B 26 1637
12. Kim M C, Shamiryan D, Jung Y, Boullart W, Kang C J and Cho H K 2006 J. Vac. Sci. Technol. A 24 2645
13. Mahorowala A P, Chen K J, Sooriyakumaran R, Clancy A, Murthy D and Rasgon S 2005 Line Edge Roughness Reduction by Plasma Curing Photoresists (San Jose, CA, 2 March 2005) Proc. SPIE 5753 380
14. Padmanaban M, Alemy E, Dammel R, Kim W K, Kudo T, Lee S H, Rahman D, Chen W L, Sadjadi R M, Livesay W and Ross M 2002 J. Photopolym. Sci. Technol. 15 521
15. Pargon E, Martin M, Menguelti K, Azarnouche L, Foucher J and Joubert O 2009 Appl. Phys. Lett. 94 103111
16. Pargon E, Menguelti K, Martin M, Bazin A, Chaix-Pluchery O, Sourd C, Derrough S, Lill T and Joubert O 2009 J. Appl. Phys. 105 094902
17. Takeda K, Asahara H, Hanawa T, Tsujita K, Okumura H and Hishinuma N 2003 J. Photopolymer Sci. Technol. 16 511
18. Nest D 2009 Dissertation Thesis University of California, Berkeley
19. Nest D, Graves D B, Engelmann S, Bruce R L, Weilnboeck F, Oehrlien G S, Andes C and Hudson E A 2008 Appl. Phys. Lett. 92 153113
20. Titus M J, Nest D, Chung T Y and Graves D 2009 J. Phys. D: Appl. Phys. 42 245205
21. GuoWand Sawin H H 2009 J. Phys. D: Appl. Phys. 42 194014
22. Radmilovic-Radjenovic M, Radjenovic B and Petrovic Z L J 2009 Thin Solid Films 517 3954
23. Titus M J, Nest D and Graves D B 2009 Appl. Phys. Lett. 94 171501
24. Godyak V A, Piejak R B and Alexandrovich B M 1992 Plasma Souces Sci. Technol. 1 36
25. Singh H and Graves D B 2000 J. Appl. Phys. 87 4098-106
26. Braithwaite N S J, Booth J P and Cunge G 1996 Plasma Souces Sci. Technol. 5 677-84
27. Titus M J, Nest D and Graves D B 2009 J. Phys. D: Appl. Phys. (FTC) 42 152001
28. Koval Y 2004 J. Vac. Sci. Technol. B 22 843
29. Vegh J J, Nest D, Graves D B, Bruce R, Engelmann S, Kwon T, Phaneuf R J, Oehrlein G S, Long B K and Willson C G 2008 J. Appl. Phys. 104 034308
30. Vegh J J, Nest D, Graves D B, Bruce R, Engelmann S, Kwon T, Phaneuf R J, Oehrlein G S, Long B K and Wilson C G 2007 Appl. Phys. Lett. 91 233113
31. Hill D J T and O'Donnell J H 1981 J. Chem. Educ. 58 174
32. Knappe W and Yamamoto O 1970 Kolloid-Z. u.Z. Polymere 240 8
33. Huang R 2005 J. Mech. Phys. Solids 53 63
34. Huang R and Im S H 2006 Phys. Rev. E 74 026214
35. Huang R and Suo Z 2001 J. Appl. Phys. 91 1135
36. Huang Z, Hong W and Suo Z 2004 Phys. Rev. E 70 030601
37. McKenzie D R, Muller D and Pailthorpe B A 1991 Phys. Rev. Lett. 67 773