Line edge roughness reduction by plasma curing photoresists

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5753, Issue I, 2005, Pages 380-389

  Mahorowala, Arpan P ^a   Chen, Kuang Jung ^b   Sooriyakumaran, Ratnam ^c   Clancy, Aleksandra ^a   Murthy, Dakshi ^d   Rasgon, Stacy ^e  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c IBM ALMADEN RESEARCH CENTER   (United States)

^d ADVANCED MICRO DEVICES   (United States)

^e MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Activation energy; ArF; Deprotection; LER; LWR; Photoresist; Plasma cure; Plasma etch; Protecting unit; Surface roughness

Indexed keywords

ARF; DEPROTECTION; LINE EDGE ROUGHNESS (LER); LWR; PLASMA CURE; PLASMA ETCH; PROTECTING UNITS;

ACTIVATION ENERGY; CURING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GATES (TRANSISTOR); OPTICAL FILMS; PLASMA ETCHING; POLYMERS; POLYSILICON; REDUCTION; SURFACE ROUGHNESS;

PHOTORESISTS;

EID: 24644459525     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.600043     Document Type: Conference Paper

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