A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

Microsystem Technologies

Volumn 17, Issue 1, 2011, Pages 149-160

  Mohammadi, Abdolreza R ^a   Bennington, Chad P J ^a   Chiao, Mu ^a  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ABSOLUTE VALUES; ADHESIVE BONDING TECHNIQUES; AVERAGE SENSITIVITIES; BONDING AGENT; CAPACITIVE PRESSURE; CAPACITIVE PRESSURE SENSORS; CHIP BONDING; CURING ADHESIVES; FULL SCALE; HARSH ENVIRONMENT; HIGH TEMPERATURE; KRAFT DIGESTER; KRAFT PULPING; LOCAL MAXIMUM; LOW VISCOSITY; PARYLENES; PRESSURE SENSOR DIAPHRAGMS; RESISTANCE TEMPERATURE DETECTORS; SILICON CHIP; SILICON DIOXIDE LAYERS; THERMAL ERROR; THIN LAYERS;

DIAPHRAGMS; KRAFT PROCESS; PLATINUM; PRESSURE SENSORS; PULP DIGESTERS; SILICA; TEMPERATURE MEASURING INSTRUMENTS; TEMPERATURE SENSORS;

KRAFT PULP;

DIAPHRAGMS; KRAFT PULPING; PLATINUM; PRESSURE; SENSORS; SILICA; THERMOMETERS;

EID: 79251612440     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-010-1195-5     Document Type: Article

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