A simple method for adhesive bonding of capacitive pressure sensors

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 10, Issue , 2010, Pages 575-581

  Mohammadi, Abdolreza R ^a   Chiao, Mu ^a  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITIVE SENSORS; CURING; HIGH TEMPERATURE APPLICATIONS; SILICON WAFERS; TRACE ELEMENTS; WAFER BONDING;

ADHESIVES BONDING; CAPACITIVE PRESSURE SENSORS; CAPILLARY FORCE; CURING ADHESIVES; LOW-COSTS; METAL TRACES; SIMPLE METHOD; SIMPLE++; ULTRAVIOLET CURING; ULTRAVIOLET-CURING;

PRESSURE SENSORS;

EID: 84881436943     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2010-39123     Document Type: Conference Paper

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