Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding

Journal of Microelectromechanical Systems

Volumn 15, Issue 3, 2006, Pages 515-522

  Chiao, Mu ^a   Lin, Liwei ^b  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Aluminum to silicon nitride bonding; Microelectromechanical systems (MEMS) packaging; Vacuum packaging and accelerated testing; Wafer bonding

Indexed keywords

BONDING; ELECTRONICS PACKAGING; ESTIMATION; MICROMACHINING; RESONATORS; STATISTICAL METHODS;

ACCELERATED TESTING; ALUMINUM-TO-SILICON NITRIDE BONDING; MICROELECTROMECHANICAL SYSTEMS (MEMS PACKAGING; VACUUM PACKAGING; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 33745171447     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.876798     Document Type: Article

References (43)

1. L. Lin, "Mems post-packaging by localized heating and bonding," IEEE Trans. Adv. Packag., vol. 23, pp. 608-616, Nov. 2000.
2. M. Chiao and L. Lin, "Sealing technologies," in MEMS Packag., T.-R. Hsu, Ed., 2004, ch. 3, pp. 61-83.
3. W. C. Tang, "Electrostatic comb drive for resonant sensor and actuator applications," Ph.D. dissertation, Univ. Calif. Berkeley, 1990.
4. L. Lin, R. T. Howe, and A. P. Pisano, "Microelectromechanical filters for signal processing," J. Microelectromech. Syst., vol. 7, pp. 286-294, Sep. 1998.
5. H. Guckel, "Surface micromachined pressure transducers," Sens. Actuators A, Phys., vol. A28, no. 2, pp. 133-146, 1991.
6. J. Lund, C. Jahnes, H. Deligianni, P. Buchwalter, J. Cotte, P. Andricacos, D. Seeger, and J. Magerlein, "A low temperature bicmos compatible process for mems rf resonators and filters," in Tech. Dig. Solid-State Sens., Actuator and Microsyst. Workshop, 2002, pp. 38-41.
7. M. Bartek, J. Foerster, and R. Wolffenbuttel, "Vacuum sealing of microcavities using metal evaporation," Sens. Actuators A, Phys., vol. A61, no. 1-3, pp. 364-368, 1997.
8. B. Stark and K. Najafi, "A low-temperature thin-film electroplated metal vacuum package," J. Microelectromech. Syst., vol. 13, pp. 147-157, Apr. 2004.
9. P. P. Chang-Chien and K. D. Wise, "Wafer-level packaging using localized mass deposition," in 11th Int. Conf. Solid-State Sens. Actuators, Transducer's 01, Tech. Dig., Munich, Germany, 2001, pp. 182-185.
10. A. Chavan and K. Wise, "Batch-processed vacuum-sealed capacitive pressure sensors," J. Microelectromech. Syst., vol. 10, no. 4, pp. 580-588, Dec. 2001.
11. S. Kobayashi, K. Ohwada, T. Hara, T. Oguchi, Y. Asaji, and K. Yaji, "Double-frame silicon gyroscope packaged under low pressure by wafer bonding," Trans. Inst. Elect. Eng. Japan, Part E, vol. 120-E, pp. 111-115, Mar. 2000.
12. M. Shimbo, K. Furukawa, K. Fukuda, and K. Tanzawa, "Silicon-to-silicon direct bonding method," J. Appl. Phys., vol. 60, pp. 2987-2989, Oct. 1986.
13. C. Harendt, H. Graf, B. Hofflinger, and J. Penteker, "Silicon fusion bonding and its characterization," J. Micromech. Microeng., vol. 2, pp. 113-116, 1992.
14. M. B. Cohn, "Assembly techniques for microelectromechanical systems," Ph.D. dissertation, Univ. Calif. Berkeley, 1997.
15. Y. Cheng, L. Lin, and K. Najafi, "Localized silicon fusion and eutectic bonding for mems fabrication and packaging," J. Microelectromech. Syst., vol. 9, pp. 3-8, Mar. 2000.
16. Y. Cheng, W. T. Hsu, L. Lin, C. T. Nguyen, and K. Najafi, "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," in Proc. IEEE Micro Electro Mech. Syst., Jan. 2001, pp. 18-21.
17. M. Chiao and L. Lin, "Hermetic wafer bonding by rapid thermal processing," Tech. Dig. Solid-State Sens. Actuator Workshop, pp. 142-149, 2000.
18. H. Tilmans, D. van de Peer, and E. Beyne, "The indent reflow sealing (irs) technique-a method for the fabrication of sealed cavities for mems devices," J. Microelectromech. Syst., vol. 9, no. 2, pp. 206-217, Jun. 2000.
19. S. Mack, H. Baumann, and U. Gosele, "Gas tightness of cavities sealed by silicon wafer bonding," in Proc. IEEE 10th Ann. Int. Workshop Micro Electro Mechan. Syst., Jan. 1997, pp. 488-493.
20. Q.-Y. Tong and U. Gosele, Semiconductor Wafer Bonding, Science and Technology. New York: Wiley, 1999.
21. Electronic Packaging and Interconnection Handbook, C. Harper, Ed., MaGraw-Hill, New York, 1991.
22. J. Lau and Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. New York: McGraw-Hill, 1997.
23. Microelectronics Packaging Handbook, 3rd ed., Chapman and Hall, New York, 1997.
24. Accelerated moisture resistance-unbiased autoclave (2000).
25. B. Ziaie, A. V. Arx, M. Dokmeci, and K. Najafi, "A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators," Journal of Microelectromech. Syst., vol. 5, pp. 166-179, Sept. 1996.
26. Y. Cheng, L. Lin, and K. Najafi, "Reliability of hermetic encapsulation by localized aluminum/silicon-to-glass bonding," in Proc. IEEE. 13th Ann. Int. Workshop on Micro Electro Mech. Syst., Jan. 2000, pp. 757-762.
27. M. Chiao and L. Lin, "Hermetic wafer bonding based on rapid thermal processing," Sens. Actuators A, Phys., vol. 91, pp. 398-402, 2001.
28. M. Chiao and L. Lin, "Accerlerated hermeticity testing of a glass-silicon package formed by RTP aluminum-to-silicon nitride bonding," Sens. Actuators A, Phys., vol. A97-98, pp. 405-409, 2002.
29. W. Tang, T. Nguyen, M. Judy, and R. Howe, "Electrostatic-comb drive of lateral polysilicon resonat ors," Sens. Actuators A, Phys., vol. 21, pp. 328-331, 1990.
30. P.O. Box 2189, 20847-2189.
31. Heatpulse 210T, STEAG RTP Systems Inc.. 4425 Fortran Dr., 95134-2300.
32. H. Ogata, K. Kanayama, M. Ohtani, K. Fujiwara, and H. Abe, "Diffusion of aluminum into silicon nitride films," Thin Solid Films, vol. 48, pp. 333-338, 1978.
33. A. Oliver and C. Matzke, "100% foundry compatible packaging and full wafer release/die seperation technique for surface micromachined devices," Late News Dig. Solid-State Sens. Actuator Workshop, pp. 5-6, 2000.
34. Handbook of Materials and Techniques for Vacuum Devices, Amer. Inst. Phys., 1995.
35. Handbook of Electron Tube and Vacuum Techniques, Addison-Wesley, Reading, MA, 1965.
36. A. Roth, Vacuum Sealing Techniques. New York: Pergamon, 1966.
37. J. F. O'hanlon, A User's Guide to Vacuum Technology, 2nd ed. New York: Wiley, 1989.
38. V.V. Technologies, Palo Alto, CA. 3120 Hansen Way, M/S D-104, Bldg. 4, 94304.
39. Y. Cheng, W.-T. Hsu, K. Najafi, C.-C. Nguyen, and L. Lin, "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," J. Microelectromech. Syst., vol. 11, pp. 556-564, Oct. 2002.
40. D. M. Freeman and C. Q. Davis, "Using video microscopy to characterize micromechanics of biological and man-made micromachines," in Tech. Dig. Solid-State Sens. Actuator Workshop, Jun. 1996, pp. 161-167.
41. C. A. Clifford, Truncated and Censored Samples. New York: Marcel Dekker, 1991.
42. E. Lewis, Introduction to Reliability Engineering, 2nd ed. New York: Wiley, 1994.
43. W. Brown, Advanced Electronic Packaging. New York: IEEE, 1999.