Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Journal of Microelectromechanical Systems

Volumn 11, Issue 5, 2002, Pages 556-565

  Cheng, Yu T ^b   Hsu, Wan Tai ^a,b   Najafi, Khalil ^a,b   Nguyen, Clark T C ^a,b   Lin, Liwei ^c  

^a IEEE

^b UNIVERSITY OF MICHIGAN   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Localized heating; MEMS packaging; Microresonators; Vacuum encapsulation; Wafer level packaging

Indexed keywords

ALUMINUM; DIELECTRIC MATERIALS; ENCAPSULATION; GLASS BONDING; HEAT FLUX; HEAT SINKS; MATHEMATICAL MODELS; PRESSURE GAGES; RESONATORS; SILICON WAFERS; SUBSTRATES; VACUUM APPLICATIONS;

MICROHEATER; PRESSURE MONITORS; QUALITY FACTOR; SILICON SUBSTRATE; VACUUM ENCAPSULATION;

ELECTRONICS PACKAGING;

EID: 0036772724     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.802903     Document Type: Article

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