Development of a compensated capacitive pressure and temperature sensor using adhesive bonding and chemical-resistant coating for multiphase chemical reactors

Sensors and Actuators, A: Physical

Volumn 163, Issue 2, 2010, Pages 471-480

  Mohammadi, Abdolreza R ^a   Graham, Tim C M ^a   Bennington, Chad P J ^a   Chiao, Mu ^a  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

Bonding; Capacitive pressure sensor; Chemical process monitoring; Harsh environment; Heat curing adhesive; High temperature; Kraft pulp digesters; Parylene coating; SU 8

Indexed keywords

CAPACITIVE PRESSURE SENSOR; CHEMICAL PROCESS MONITORING; HARSH ENVIRONMENT; HEAT CURING ADHESIVE; HIGH TEMPERATURE; PARYLENE COATINGS; SU-8;

CHEMICAL ENGINEERING; CHEMICAL REACTORS; COATINGS; CURING; DIAPHRAGMS; KRAFT PROCESS; KRAFT PULP; PARTIAL PRESSURE SENSORS; PLATINUM; PRESSURE SENSORS; PROCESS CONTROL; PROCESS MONITORING; SILICA; TEMPERATURE MEASURING INSTRUMENTS; TEMPERATURE SENSORS;

PULP DIGESTERS;

CHEMICAL ENGINEERING; CHEMICAL REACTIONS; CHEMICAL REACTORS; DIAPHRAGMS; DIGESTERS; HIGH TEMPERATURE; KRAFT PULPS; PARTIAL PRESSURE; SENSORS; SILICA;

EID: 78049486527     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2010.08.024     Document Type: Article

References (62)

1. T.C.M. Graham, E. Liu, A.R. Mohammadi, N. Sadeghi, E. Albadvi, S. Mirabbasi, M. Chiao, J.D. Madden, and C.P.J. Bennington Development of a flow-following sensor package for application in chemical pulp digesters Exfor & Annual Meeting, Montreal, Canada, February 2010 51 59
2. D.S. Vlaev, and C.P.J. Bennington Flow of liquor through wood chips in a model digester Chem. Eng. Commun. 193 2006 879 890
3. F. Rusinsky, and C.P.J. Bennington Aspects of liquor flow in a model chip digester measured using electrical resistance tomography Chem. Eng. J. 130 2007 67 74
4. Q.F. Lee, and C.P.J. Bennington Spatial distribution of Kappa number in batch digesters: 2D model J. Pulp Paper Sci. 33 4 2007 206 216
5. G.A. Smook Handbook for Pulp and Paper Technologists 2002 Angus Wilde Publications Vancouver, Canada pp. 84-97
6. Chapter 5 and 6 in Chemical Pulping: Papermaking Science and Technology J. Gullichsen, C.-J. Fogelholm, Book 6A 2000 Fapet Oy Helsinki, Finland
7. T.M. Grace, B. Leopold, Alkaline Pulping, vol. 5 3rd ed. M.J. Kocurek, Pulp and Paper Manufacture 1989 The Joint Text Book Committee of the Paper Industry, TAPPI/CPPT Canada
8. W.P. Eaton, and J.H. Smith Micromachined pressure sensors: review and recent developments Smart Mater. Struct. 6 1997 530 539
9. Y.S. Lee, and K.D. Wise A batch-fabricated silicon capacitive pressure transducer with low temperature sensitivity IEEE Trans. Electron Devices ED 29 1982 42 49
10. S.K. Clark, and K.D. Wise Pressure sensitivity in anisotropically etched thin-diaphragm pressure sensors IEEE Trans. Electron Devices 26 1979 1887 1896
11. H.L. Chau, and K.D. Wise Scaling limits in batch-fabricated silicon pressure sensors IEEE Trans. Electron Devices ED 34 1987 850 858
12. C.S. Sander, J.W. Knutt, and J.D. Meindl A monolithic capacitive pressure sensor with pulse-period output IEEE Trans. Electron Devices ED 27 5 1980 927 930
13. A.V. Chavan, and K.D. Wise Batch-processed vacuum-sealed capacitive pressure sensors J. Microelectromech. Syst. 10 2001 580 588
14. G. Blazquez, P. Pons, and A. Boukabache Capabilities and limits of silicon pressure sensors Sens. Actuators 17 1989 387 403
15. A. Etouhami, N. Zahid, and M. Elbelkacemi A novel capacitive pressure sensor structure with high sensitivity and quasi-linear response Comptes Rendus Mecanique 332 2004 141 146
16. P. Martins, S. Beclin, S. Brida, S. Metivet, O. Stojanovic, and C. Malhaire Design of bossed silicon membranes for high sensitivity microphone applications Microsyst. Technol. 13 2007 1495 1500
17. S.T. Moe, K.S. Henriksen, D.T. Wang, E. Lund, J. Nysæther, L. Furuberg, M. Visser, T. Fallet, and R.W. Bernstein Capacitive differential pressure sensor for harsh environments Sens. Actuators 83 2000 30 33
18. H. Sandmaier, and K. Kuhl A square-diaphragm piezoresistive pressure sensor with a rectangular central boss for low-pressure range IEEE Trans. Electron Devices 40 1993 1754 1759
19. S.T. Cho, K. Najafi, and K.D. Wise Secondary sensitivities and stability of ultrasensitive silicon pressure sensors Tech Digest IEEE Solid-State Sensor and Actuator Workshop Hilton Head, SC 1990
20. W.D. Frobenius, A.C. Sanderson, and H.C. Nathanson A microminiature, solid-state capacitive blood pressure sensor transducer with improved sensitivity IEEE Trans. Biomed. Eng. BME 20 1973 312 314
21. W. Gopel, J. Hesse, J.N. Zemel, Sensors: A Comprehensive Survey, Mechanical Sensors vol. 7 1994 Wiley Weinheim, Germany 105 144
22. W.H. Ko Solid-state capacitive pressure transducer Sens. Actuators A 10 1986 303 320
23. K.W. Lee, and K.D. Wise SENSIM: a simulation program for solid-state pressure sensors IEEE Trans. Electron Devices ED 29 1982 34 41
24. T.Y. Bin, and R.S. Huang CAPSS: a thin diaphragm capacitive pressure sensor simulator Sens. Actuators A 11 1987 1 22
25. S. Middelhoek Handbook of Sensors and Actuators vol. 8 2000 Elsevier Amsterdam p. 83
26. A. Hanneborg, M. Nese, H. Jakobsen, and R. Holm Silicon-to-thin film anodic bonding J. Micromech. Microeng. 2 1992 117 121
27. T. Rogers, and J. Kowal Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors Sens. Actuators A 46-47 1995 113 120
28. A Berthold, L. Nicola, P.M. Sarro, and M.J. Vellekoop Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers Sens. Actuators A 82 2000 224 228
29. P.W. Barth Silicon fusion bonding for fabrication of sensors, actuators and microstructures Sens. Actuators A 21-23 1990 919 926
30. A Singh, D.A. Horsley, M.B. Cohn, A.P. Pisano, and R.T. Howe Batch transfer of microstructures using flip-chip solder bonding IEEE J. Microelectromech. Syst. 8 1999 276 333
31. Y. Cheng, W. Hsu, K. Najafi, C.T. Nguyen, and L. Lin Vacuum packaging technology using localized aluminum/silicon-to-glass bonding J. Microelectromech. Syst. 11 2002 556 565
32. D. Sparks, S. Massoud-Ansari, and N. Najafi Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs J. Micromech. Microeng. 15 2005 1560 1564
33. R. Knechtel Glass frit bonding: an universal technology for wafer level encapsulation and packaging Microsyst. Technol. 12 2005 63 68
34. A. Mohan, A.P. Malshe, S. Aravamudhan, and S. Bhansali Piezoresistive MEMS pressure sensor and packaging for harsh oceanic environment Electronic Components and Technology Conference 2004 948 950
35. M. Chiao, and L. Lin Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding J. Microelectromech. Syst. 15 3 2006 515 522
36. Q. Wang, S.H. Choa, W. Kim, J. Hwang, S. Ham, and C. Moon Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging J. Electron. Mater. 35 3 2006 425 432
37. F. Niklaus, G. Stemme, J.Q. Lu, and R.J. Gutmann Adhesive wafer bonding J. Appl. Phys. 99 2006 031101
38. J. Oberhammer, F. Niklaus, and G. Stemme Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities Sens. Actuators A 105 2003 297 304
39. B.G. Yacobi, S. Martin, K. Davis, A. Hudson, and M. Hubert Adhesive bonding in microelectronics and photonics J. Appl. Phys. 91 10 2002 6227 6262
40. A. Bayrashev, and B. Ziaie Silicon wafer bonding through RF dielectric heating Sens. Actuators A 103 2003 16 22
41. B. Ilic, P. Neuzil, T. Stanczyk, D. Czaplewski, and G.J. Maclay Low temperature nafion bonding of silicon wafers Electrochem. Solid State Lett. 2 1999 86 87
42. H. Kim, and K. Najafi Characterization of low-temperature wafer bonding using thin-film parylene J. Microelectromech. Syst. 14 6 2005 1347 1355
43. H.S. Noh, K.S. Moon, C. Cannon, P.J. Hesketh, and C.P. Wong Wafer bonding using microwave heating of parylene intermediate layers J. Micromech. Microeng. 14 2004 625 631
44. C.T. Pan, H. Yang, S.C. Shen, M.C. Chou, and H.P. Chou A low-temperature wafer bonding technique using patternable materials J. Micromech. Microeng. 12 2002 611 615
45. C. Pang, Z. Zhao, L. Du, and Z. Fang Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors Sens. Actuators A 147 2008 672 676
46. W.H. Ko, M.H. Bao, and Y.D. Hong A high-sensitivity integrated-circuit capacitive pressure transducer IEEE Trans. Electron Devices ED 29 1 1982 48 56
47. K. Kasten, N. Kordas, H. Kappert, and W. Mokwa Capacitive pressure sensor with monolithically integrated CMOS readout circuit for high temperature applications Sens. Actuators A 97-98 2002 83 87
48. C.H. Wu, C.A. Zorman, and M. Mehregany Fabrication and testing of bulk micromachined silicon carbide piezoresistive pressure sensors for high temperature applications IEEE Sens. J. 6 2006 316 324
49. M.R. Werner, and W.R. Fahrner Review on materials, microsensors, systems, and devices for high-temperature and harsh-environment applications IEEE Trans. Ind. Electron. 48 2001 249 257
50. M Mehregany, and C.A. Zorman SiC MEMS: opportunities and challenges for applications in harsh environments Thin Solid Films 355-356 1999 518 524
51. M.A. Fonseca, J.M. English, M.V. Arx, and M.G. Allen Wireless micromachined ceramic pressure sensor for high-temperature applications J. Microelectromech. Syst. 11 2002 337 343
52. K. Dyrbye, T.R. Brown, and G.F. Eriksen Packaging of physical sensors for aggressive media applications J. Micromech. Microeng. 6 1996 187 192
53. W.S. Czarnocki Media-isolated sensor Sens. Actuators A 67 1998 142 145
54. L.S. Pakula, H. Yang, H.T.M. Pham, P.J. French, and P.M. Sarro Fabrication of a CMOS compatible pressure sensor for harsh environments J. Micromech. Microeng. 14 2004 1478 1483
55. C. Malhaire, and D. Barbier Design of a polysilicon-on-insulator pressure sensor with original polysilicon layout for harsh environment Thin Solid Films 427 2003 362 366
56. J.J. Licari Coating Materials for Electronic Applications - Polymers, Processes Reliability and Testing 2003 Noyes Publications
57. Z. Hua, O. Srivannavit, Y. Xia, and E. Gulari A compact chemical-resistant microvalve array using parylene membrane and pneumatic actuation International Conference on MEMS, NANO and Smart Systems 2004
58. M. Day, J.D. Cooney, and D.M. Wiles The thermal stability of poly (aryl-ether-ether-ketone) as assessed by thermogravimetry J. Appl. Polym. Sci. 38 1989 323
59. Techline Coatings' datasheet, http://www.techlinecoatings.com.
60. K. Kasten, J. Amelung, and W. Mokwa CMOS-compatible capacitive high temperature pressure sensors Sens. Actuators 85 2000 147 152
61. Freescale Semiconductor' datasheets, http://www.freescale.com
62. U. Esashi, N. Ura, and Y. Uatsumoto Anodic bonding for integrated capacitive sensors IEEE Proceedings Micro Electro Mechanical Systems Germany 1992 43 48