Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 425-432

  Wang, Qian ^a   Choa, Sung Hoon ^a   Kim, Woonbae ^a   Hwang, Junsik ^a   Ham, Sukjin ^a   Moon, Changyoul ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Au Sn bonding; Hermeticity; Radio frequency microelectromechanical system (RF MEMS); Wafer level packaging

Indexed keywords

EUTECTIC BONDING TECHNOLOGY; HERMETIC PROTECTION; PERFORMANCE DEGRADATION; RADIO FREQUENCY MICROELECTROMECHANICAL SYSTEM (RF-MEMS;

CONTAMINATION; ELECTRONICS PACKAGING; EUTECTICS; HERMETIC DEVICES; METALLIZING; RELIABILITY; ROBUSTNESS (CONTROL SYSTEMS); SHEAR STRENGTH; WSI CIRCUITS;

MICROELECTROMECHANICAL DEVICES;

EID: 33645567577     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690529     Document Type: Article

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