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Israel Journal of Chemistry

Volumn 50, Issue 3, 2010, Pages 312-320

Superconformal electrodeposition for 3-dimensional interconnects

(2) Moffat, Thomas P a Josell, Daniel a

a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

Author keywords

copper; electrochemistry; electrodeposition; electroplating; microfabrication

Indexed keywords

EID: 78449251898 PISSN: 00212148 EISSN: 18695868 Source Type: Journal
DOI: 10.1002/ijch.201000029 Document Type: Review

Times cited : (30)

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