Superfilling and the curvature enhanced accelerator coverage mechanism

Electrochemical Society Interface

Volumn 13, Issue 4, 2004, Pages 46-52

  Moffat, T P ^a   Wheeler, D ^b   Josell, D ^b  

^a Natl Inst for Std and Technology   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURVATURE ENHANCED ACCELERATOR COVERAGE MECHANISM (CEAC); DAMASCENE; LOCAL CURVATURE; SUPERFILLING;

ASPECT RATIO; CATALYSTS; COMPUTER SIMULATION; DIFFUSION; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; FILLING; FILM GROWTH; METALLIZING; OPTICAL INTERCONNECTS;

COPPER;

EID: 12344335576     PISSN: 10648208     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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