Two-step filling in Cu electroless deposition using a concentration- dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid

Electrochemical and Solid-State Letters

Volumn 11, Issue 1, 2008, Pages

  Lee, Chang Hwa ^a,c   Kim, Ae Rim ^a   Kim, Soo Kil ^b   Koo, Hyo Chol ^a   Cho, Sung Ki ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER; DEPOSITION;

DIMETHYLAMINODITHIOCARBAMOYL-1-PROPANESULFONIC ACID; SURFACE CONCENTRATIONS; TWO STEP FILLING;

ELECTROLESS PLATING;

EID: 36148933791     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2798877     Document Type: Article

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