Superfilling when adsorbed accelerators are mobile

Journal of the Electrochemical Society

Volumn 154, Issue 4, 2007, Pages

  Josell, D ^a   Moffat, T P ^a,b   Wheeler, D ^a,b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER COMPOUNDS; MATHEMATICAL MODELS; OPTICAL INTERCONNECTS; REACTION KINETICS;

CURVATURE ENHANCED ACCELERATOR COVERAGE (CEAC); DAMASCENE COPPER INTERCONNECTS; INDUSTRIAL PROCESSING;

ELECTRODEPOSITION;

EID: 33947176271     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2434684     Document Type: Article

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