Improved reliability of copper interconnects using alloying

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2010, Pages

  Gambino, Jeffrey P ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPPING LAYER; COPPER INTERCONNECTS; CRITICAL INTERFACES; CU DIFFUSION; IMPROVED RELIABILITY; SEED LAYER; SIMPLE METHOD;

ALLOYS; ELECTROMIGRATION; FAILURE ANALYSIS; GRAIN BOUNDARIES; INTEGRATED CIRCUITS; MANGANESE; MANGANESE COMPOUNDS; QUALITY ASSURANCE; SILVER;

COPPER ALLOYS;

EID: 77956423917     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPFA.2010.5532242     Document Type: Conference Paper

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