Electromigration and diffusion in pure Cu and Cu(Sn) alloys

Materials Research Society Symposium - Proceedings

Volumn 427, Issue , 1996, Pages 95-106

  Hu, C K ^a   Lee, K L ^a   Gupta, D ^a   Blauner, P ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPOSITION EFFECTS; COPPER; COPPER ALLOYS; CURRENT DENSITY; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; RADIOACTIVE TRACERS; THERMAL EFFECTS;

BINDING DEFECTS; ELECTROMIGRATION DRIFT VELOCITY;

ELECTROMIGRATION;

EID: 0030418884     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-427-95     Document Type: Conference Paper

References (29)