CuAl alloy: A robust solution for 45/32nm integration

Advanced Metallization Conference (AMC)

Volumn , Issue , 2008, Pages 385-389

  Vanypre, Thomas ^a,b   Mourier, Thierry ^c   Jourdan, Nicolas ^d   Cordeau, Maryline ^c   Torres, Joaquin ^d  

^a NXP SEMICONDUCTORS   (France)

^b INSTITUT DES NANOTECHNOLOGIES DE LYON   (France)

^c CEA LETI   (France)

^d STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; IMPURITIES; METALLIZING; SEMICONDUCTOR DOPING; TANTALUM COMPOUNDS;

ALUMINIUM ATOMS; COPPER RESISTIVITIES; CUAL ALLOYS; FREE INTERFACES; INTER-CONNECTS; RELIABILITY PERFORMANCES; ROBUST SOLUTIONS;

ALUMINUM;

EID: 55349118126     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. W.F.A. Besling, T. Vanypre, AMC 2005, 735 (2006).
2. K.L. Lee et al., J. Appl. Phys, 78, p4428 (1995)
3. S. Yokogawa et al., J. Appl. Phys, 101, 013513 (2007).
4. T. Vanypre et al., Microelec. Eng, 83, 11, 2373 (2006)
5. A. Kohn et al. J. Appl. Phys, 94, 6, p3810.