Thermal stability of Cu(W) and Cu(Mo) films for advanced barrierless Cu metallization: Effects of annealing time

Journal of Electronic Materials

Volumn 35, Issue 11, 2006, Pages 1933-1936

  Chu, J P ^a   Lin, C H ^b  

^a NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

^b CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Barrierless; Copper metallization; Focused ion beam (FIB); Thermal reliability

Indexed keywords

BARRIERLESS; COPPER METALLIZATION; FOCUSED ION BEAM (FIB); THERMAL RELIABILITY;

ANNEALING; COPPER ALLOYS; MAGNETRON SPUTTERING; MICROSTRUCTURE; THERMODYNAMIC STABILITY; X RAY DIFFRACTION;

THIN FILMS;

EID: 33845726941     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0296-5     Document Type: Conference Paper

References (15)

1. J.O. Olowolafe, J. Li, J.W. Mayer, and E.G. Colgan, Appl. Phys. Lett. 58, 469 (1991).
2. D.H. Kim, S.L. Cho, K.B. Kim, J.J. Kim, J.W. Park, and J.J. Kim, Appl. Phys. Lett. 69, 4182 (1996).
3. C.-K. Hu, L. Gignac, R. Rosenbeng, E. Liniger, J. Rubino, and C. Sambucetti, Appl. Phys. Lett. 81, 1782 (2002).
4. C.-K. Hu, L. Gignac, E. Liniger, B. Herbst, and D.L. Rath, Appl. Phys. Lett. 83, 869 (2003).
5. J. Koike and M. Wada, Appl. Phys. Lett. 87, 041911 (2005).
6. S. Tsukimoto, T. Morita, M. Moriyama, K. Ito, and M. Murakami, J. Electron. Mater. 34, 592 (2005).
7. J.P. Chu and C.H. Lin, Appl. Phys. Lett. 87, 211902 (2005).
8. J.P. Chu, C.H. Chung, P.Y. Lee, J.M. Rigsbee, and J.Y. Wang, Metall. Mater. Trans. A 29A, 647 (1998).
9. J.P. Chu and T.N. Lin, J. Appl. Phys. 85, 6462 (1999).
10. J.P. Chu, C.J. Liu, C.H. Lin, and S.F. Wang, Mater. Chem. Phys. 72, 286 (2001).
11. C.H. Lin, J.P. Chu, T. Mahalingam, T.N. Lin, and S.F. Wang, J. Mater. Res. 18, 1429 (2003).
12. C.H. Lin, J.P. Chu, T. Mahalingam, T.N. Lin, and S.F. Wang, J. Electron. Mater. 32, 1235 (2003).
13. J.P. Chu, Y.Y. Hsieh, C.H. Lin, and T. Mahalingam, J. Mater. Res. 20, 1379 (2005).
14. J.P. Chu, C.H. Lin, and Y.Y. Hsieh, J. Electron. Mater. 35, 76 (2006).
15. K. Barmak, A. Gungor, C. Cabrai, Jr., and J.M.E. Harper, J. Appl. Phys. 94, 1605 (2003).