Self-forming diffusion barrier layer in Cu-Mn alloy metallization

Applied Physics Letters

Volumn 87, Issue 4, 2005, Pages

  Koike, J ^a   Wada, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CU-MN ALLOY METALLIZATION; DIFFUSION BARRIERS; SELF-FORMING DIFFUSION; SURFACE OXIDE LAYERS;

AMORPHOUS MATERIALS; DIFFUSION; INTERFACES (MATERIALS); METALLIZING; SEMICONDUCTOR DEVICES; THIN FILMS; X RAY SPECTROSCOPY;

COPPER ALLOYS;

EID: 23744448019     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1993759     Document Type: Article

References (18)

1. P. J. Ding, W. A. Lanford, S. Hymes, and S. P. Murarka, Appl. Phys. Lett. 64, 2897 (1994).
2. P. J. Ding, W. A. Lanford, S. Hymes, and S. P. Murarka, Appl. Phys. Lett. 75, 3627 (1994).
3. W. A. Lanford, P. J. Ding, W. Wang, S. Hymes, and S. P. Murarka, Thin Solid Films 262, 234 (1995).
4. M. J. Frederick, R. Goswami, and G. Ramanath, J. Appl. Phys. 93, 5966 (2003).
5. M. J. Frederick and G. Ramanath, J. Appl. Phys. 95, 363 (2004).
6. M. J. Frederick and G. Ramanath, J. Appl. Phys. 95, 3202 (2003).
7. K. Barmak, A. Gungor, C. Cabral, and J. M. E. Harper, J. Appl. Phys. 94, 1605 (2003).
8. K. Maier, R. Kirchheim, and G. Tolg, Mikrochim. Acta, Suppl. 8, 125 (1979).
9. K. Maier, Phys. Status Solidi B 44, 567 (1977).
10. K. Lewin, D. Sichen, and S. Seetharaman, Scand. J. Metall. 22, 310 (1993).
11. T. Nagasaka and R. Takehama, Metall. Mater. Trans. B 31B, 927 (2000).
12. H. Oyamada, T. Nagasaka, and M. Hino, Mater. Trans., JIM 12, 1225 (1998).
13. F. M. Smits, Bell Syst. Tech. J. 37, 711 (1958).
14. M. Wada and J. Koike (unpublished).
15. H. Narita, K. Kondo, and N. Morimoto, Mineral. J. 8, 329 (1977).
16. T. Usui, H. Nasu, J. Koike, M. Wada, S. Takahashi, N. Shimizu, T. Nishikawa, M. Yoshimaru and H. Shibata, Proceedings of International Conference on Interconnect Tech. Science (2005) (to be published).
17. H. Kim, J. Vac. Sci. Technol. B 21, 2231 (2003).
18. A. Krishnamoorthy, K. Chanda, S. P. Murarka, G. Ramanath, and J. G. Ryan, Appl. Phys. Lett. 78, 2467 (2001).