Reliability improvement and its mechanism for Cu interconnects with Cu-Al alloy seeds

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 467-473

  Mori, Kenichi ^a   Maekawa, Kazuyoshi ^a   Amou, Noriaki ^b   Kodama, Daisuke ^a   Miyazaki, Hiroshi ^a   Suzumura, Naohito ^a   Honda, Kazuhito ^a   Hirose, Yukinori ^a   Asai, Koyu ^a   Yoneda, Masahiro ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b Renesas Semiconductor Engineering Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COPPER ALLOYS; ELECTRIC RESISTANCE; GRAIN BOUNDARIES; RELIABILITY; THIN FILMS;

CU INTERCONNECTS; ECP-CU FILMS; SIMS ANALYSIS;

SEMICONDUCTOR DEVICES;

EID: 33947286216     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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