SCOPUS 정보 검색 플랫폼

Volumn , Issue , 2006, Pages 735-743

Extendibility of copper alloyed seed for reliability improvement

(7) Besling, Wim F A a Vanypre, Thomas a Federspiel, Xavier a Mourier, Thierry b Flake, John c Courtas, Solene a Torres, Joaquin b

a NXP SEMICONDUCTORS (Netherlands)

b STMICROELECTRONICS (France)

c FREESCALE SEMICONDUCTOR INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRON SCATTERING; ELECTROPLATING; GRAIN BOUNDARIES; PHYSICAL VAPOR DEPOSITION; TANTALUM COMPOUNDS; ACTIVATION ENERGY; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; FAILURE (MECHANICAL);

COPPER ALLOYED SEED; COPPER FILMS; COPPER RESISTIVITY; PVD BASE LINE; CU-ALLOYED SEED; EBSD MEASUREMENTS; LOW-K DIELECTRIC;

COPPER ALLOYS;

EID: 33644939395 PISSN: 15401766 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

References (9)

1
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2
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3
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4
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6
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7
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8
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- Besser¹ Sanchez² Field³

9
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.