Improvement in reliability of Cu dual-damascene interconnects using Cu-al alloy seed

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 221-226

  Maekawa, Kazuyoshi ^a   Mori, Kenichi ^a   Kobayashi, Kiyoteru ^a   Kumar, Niranjan ^b   Chu, Schubert ^b   Chen, Samuel ^b   Lai, Gigi ^b   Diehl, Daniel ^c   Yoneda, Masahiro ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b APPLIED MATERIALS INC   (United States)

^c Applied Materials Japan   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER ALLOYS; DIFFUSION; ELECTROMIGRATION; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); IONIZATION; SCANNING ELECTRON MICROSCOPY;

DUAL-DAMASCENE INTERCONNECTS; ELECTROMIGRATION RESISTANCE; INTERCONNECT MATERIALS; STRESS INDUCED VOIDING (SIV);

COPPER;

EID: 23844542064     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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