SCOPUS 정보 검색 플랫폼

Journal of Vacuum Science and Technology B

Volumn 28, Issue 3, 2010, Pages 450-459

Effect of energetic ions on plasma damage of porous SiCOH low-k materials

(8) Kunnen, E a Baklanov, M R a Franquet, A a Shamiryan, D a Rakhimova, T V a,b Urbanowicz, A M a,c Struyf, H a Boullart, W a

a IMEC (Belgium)

b MOSCOW STATE UNIVERSITY (Russian Federation)

c UNIVERSITY OF LEUVEN (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

FILMS; ION BOMBARDMENT; OXYGEN; PLASMA APPLICATIONS;

ENERGETIC ION; LOW-K FILMS; LOW-K MATERIALS; OXYGEN ATOM; OXYGEN PLASMAS; PLASMA DAMAGE; POWER; RECOMBINATION COEFFICIENT; TOP SURFACE; TRANSFORMER-COUPLED PLASMAS;

SILICON COMPOUNDS;

EID: 77953012282 PISSN: 21662746 EISSN: 21662754 Source Type: Journal
DOI: 10.1116/1.3372838 Document Type: Conference Paper

Times cited : (32)

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