Damage reduction and sealing of low- k films by combined He and NH 3 plasma treatment

Electrochemical and Solid-State Letters

Volumn 10, Issue 10, 2007, Pages

  Urbanowicz, A M ^a   Baklanov, M R ^a   Heijlen, J ^a   Travaly, Y ^a   Cockburn, A ^b  

^a IMEC   (Belgium)

^b Applied Materials Belgium   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; MONOLAYERS; PLASMA APPLICATIONS;

ABSORPTION COEFFICIENT; DAMAGE REDUCTION; EXTREME ULTRAVIOLET (EUV); PLASMA TREATMENT; SURFACE REACTIVE SITES;

DIELECTRIC FILMS;

EID: 34547849595     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2760189     Document Type: Article

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