Effect of Cu contamination on recombination of O atoms on a plasma-oxidized silicon surface

Journal of Applied Physics

Volumn 105, Issue 11, 2009, Pages

  Guha, Joydeep ^a,b   Khare, Rohit ^a   Stafford, Luc ^a,c   Donnelly, Vincent M ^a   Sirard, Stephen ^b   Hudson, Eric A ^b  

^a UNIVERSITY OF HOUSTON   (United States)

^b LAM RESEARCH CORPORATION   (United States)

^c UNIVERSITÉ DE MONTRÉAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROMETERS; CHAMBER WALLS; CU LAYERS; CYLINDRICAL SUBSTRATE; DUAL DAMASCENE; ETCHING RATE; EVAPORATION SOURCE; FREE SURFACES; IN-SITU; INTEGRATION SCHEME; LANGMUIR-HINSHELWOOD; LAST STAGE; OUT-DIFFUSION; OXIDATION STATE; OXIDIZED SILICON; OXYGEN PLASMAS; PLASMA EXPOSURE; PRESSURE GAUGES; PRESSURE RISE; REACTOR WALLS; RECOMBINATION COEFFICIENT; RECOMBINATION RATE; REDOX CYCLING; ROOM TEMPERATURE; STICKING COEFFICIENTS;

ATOMS; AUGERS; DESORPTION; ELECTRON ENERGY LEVELS; GAGES; MICROELECTRONICS; MONOLAYERS; OXYGEN; PHOTORESISTS; PLASMA ETCHING; PLASMAS; SILICON; SILICON OXIDES;

PLASMA DIAGNOSTICS;

EID: 67649498083     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3143107     Document Type: Article

References (27)

1. E. A. Hudson and S. Sirard (unpublished).
2. G. Delgadino, D. Keil, J. Booth, and C. Lee, Proceedings of the Dry Process International Symposium, 2007 (unpublished), Vol. 13.
3. S. Imai, J. Vac. Sci. Technol. A 0734-2101 27, 1 (2009). 10.1116/1.3006029
4. P. F. Kurunczi, J. Guha, and V. M. Donnelly, J. Phys. Chem. B 1089-5647 109, 20989 (2005). 10.1021/jp054190h
5. P. F. Kurunczi, J. Guha, and V. M. Donnelly, Phys. Rev. Lett. 0031-9007 96, 018306 (2006). 10.1103/PhysRevLett.96.018306
6. J. Guha, V. M. Donnelly, and Y.-K. Pu, J. Appl. Phys. 0021-8979 103, 013306 (2008). 10.1063/1.2828154
7. S. Taylor, Semicond. Sci. Technol. 0268-1242 8, 1426 (1993). 10.1088/0268-1242/8/7/037
8. N. C. M. Fuller, M. V. Malyshev, V. M. Donnelly, and I. P. Herman, Plasma Sources Sci. Technol. 0963-0252 9, 116 (2000). 10.1088/0963-0252/9/2/304
9. J. Guha, P. F. Kurunczi, L. Stafford, Y. K. Pu, and V. M. Donnelly, J. Phys. Chem. C 1932-7447 112, 8963 (2008). 10.1021/jp800788a
10. L. Stafford, J. Guha, and V. M. Donnelly, J. Vac. Sci. Technol. A 0734-2101 26, 455 (2008). 10.1116/1.2902953
11. L. Stafford, R. Khare, J. Guha, V. M. Donnelly, J. -S. Poirier, and J. Margot, J. Phys. D 0022-3727 42, 055206 (2009). 10.1088/0022-3727/42/5/055206
12. J. Guha, Y.-K. Pu, and V. M. Donnelly, J. Vac. Sci. Technol. A 0734-2101 25, 347 (2007). 10.1116/1.2699167
13. http://hypertextbook.com/facts/2004/DeannaStewart.shtml.
14. Handbook of Thin Film Technology, edited by, L. I. Maissel, and, R. Glang, (McGraw-Hill, New York, 1970).
15. CRC Handbook of Chemistry and Physics, 84th ed., edited by, D. R. Lide, (CRC, Boca Raton, Florida, 2003), online version.
16. X. Xu and D. W. Goodman, Appl. Phys. Lett. 0003-6951 61, 1799 (1992). 10.1063/1.108404
17. R. R. Hart, H. L. Dunlap, and O. J. Marsh, J. Appl. Phys. 0021-8979 46, 1947 (1975). 10.1063/1.321871
18. M. Iwamoto, H. Yahiro, K. Tanda, N. Mizuno, Y. Mine, and S. Kagawa, J. Phys. Chem. 0022-3654 95, 3727 (1991). 10.1021/j100162a053
19. D. -J. Liu and H. J. Robota, Catal. Lett. 1011-372X 21, 291 (1993). 10.1007/BF00769481
20. J. Valyon, W. S. Millman, and W. K. Hall, Catal. Lett. 1011-372X 24, 215 (1994). 10.1007/BF00811794
21. J. Valyon and W. K. Hall, J. Phys. Chem. 0022-3654 97, 7054 (1993). 10.1021/j100129a021
22. N. Selamoglu, J. A. Mucha, D. L. Flamm, and D. E. Ibbotson, J. Appl. Phys. 0021-8979 64, 1494 (1988). 10.1063/1.341823
23. J. O. Petunchi and W. K. Hall, J. Catal. 0021-9517 78, 327 (1982). 10.1016/0021-9517(82)90317-7
24. K. Ueno, V. M. Donnelly, and Y. Tsuchiya, J. Vac. Sci. Technol. B 1071-1023 16, 2986 (1998). 10.1116/1.590331
25. J. P. Espinos, J. Morales, A. Barranco, A. Caballero, J. P. Holgado, and A. R. Gonzalez-Elipe, J. Phys. Chem. B 1089-5647 106, 6921 (2002). 10.1021/jp014618m
26. J. B. Zhou, T. Gustafsson, and E. Garfunkel, Surf. Sci. 0039-6028 372, 21 (1997). 10.1016/S0039-6028(96)01100-4
27. A. A. Istratov, C. Flink, H. Hieslmair, S. A. McHugo, and E. R. Weber, Mater. Sci. Eng., B 0921-5107 72, 99 (2000). 10.1016/S0921-5107(99)00514-0